ZX-D3 High-efficient low-cost bga repair BGA Rework system with camera bga reblling Features:



1. With PLC user interface control, display actual temperature of three zone and a test temperature curve, can export temperature profile;

2. When welding,with CCD camera to monitor the melting process of solder ball;

3. With three independent temperature zone control, upper and bottom main heater with hot air to heat, third zone with infrared to preheat;

4. Three heater with 9 segment temperature up (down)+9 segment constant temperature control, can store 40 groups temperature curve;

5. Three heating zone with independent PID to control heating process, more stable and accurate;

6. Bottom heater and IR preheating zone with supporter to prevent welding zone part deformation;

7. After removal and welding with cooling fan to cool PCB board, ensure welding effect;

8. Temperature profile parameter with password protection;

9. Equipped with a variety size of hot-air nozzle, or made according to special requirements;

10. Build-in vacuum pump, no need gas sources.





SPECIFICATION

PCB Size
≤L490×W450mm

PCB Thickness
0.5~3mm

Temperature Control
K thermocouple PID Closed loop

PCB Positioning mode
Outer

Bottom preheat
Infrared 2400W

Main (Top+bottom) heater
Hot air 800W+800W

Power supply
Single phase 220V,50/60Hz,4.0KVA

Dimension
L640×W710×H580mm

Weight
Approx. 50kgs